Micro Assembly For MEMS Industry
Semiconductor Front End Process
Aerospace Aviation Industry
Intelligent and 4.0 Industry manufacturing
New energy Industry manufacturing
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3D PLUS Component Baking |
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Temp.: ≤150℃ Oxygen Concentration: 1~9999PPM Temp. Uniformity: ≤ ±2.5%
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Applicable Model: Low Humidity & Q2 Baking Oven TADHE-NO/N Serie
Cleaning O2 Monitoring Oven -DF Series
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