PCBA Microelectronics Industry

Micro Assembly For MEMS Industry

Semiconductor Front End Process

Aerospace Aviation Industry

Intelligent and 4.0 Industry manufacturing

New energy Industry manufacturing


3D PLUS Component Baking


Temp.: ≤150

Oxygen Concentration: 1~9999PPM

Temp. Uniformity: ≤ ±2.5%


Applicable Model:

Low Humidity & Q2 Baking Oven TADHE-NO/N Serie

Cleaning O2 Monitoring Oven -DF Series